參數(shù)資料
型號: LTC2255IUH#TRPBF
廠商: Linear Technology
文件頁數(shù): 16/24頁
文件大?。?/td> 0K
描述: IC ADC 14BIT 125MSPS 3V 32-QFN
產(chǎn)品培訓(xùn)模塊: LTC2262 - Ultra Low Power High Speed ADCs
標(biāo)準(zhǔn)包裝: 2,500
位數(shù): 14
采樣率(每秒): 125M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 468mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 32-QFN 裸露焊盤(5x5)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個單端,雙極; 1 個差分,雙極
LTC2255/LTC2254
23
22554fa
UH Package
32-Lead Plastic QFN (5mm
× 5mm)
(Reference LTC DWG # 05-08-1693)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTIO
U
5.00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
(UH32) QFN 1004
0.50 BSC
0.200 REF
0.00 – 0.05
0.70
±0.05
3.45
±0.05
(4 SIDES)
4.10
±0.05
5.50
±0.05
0.25
± 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
PIN 1 NOTCH R = 0.30 TYP
OR 0.35
× 45° CHAMFER
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