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參數(shù)資料
| 型號： | LTC4216 |
| 廠商： | Linear Technology Corporation |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Ultralow Voltage Hot Swap Controller |
| 中文描述： | 超低電壓熱插拔控制器 |
| 文件頁數(shù)： | 23/24頁 |
| 文件大?。?/td> | 277K |
| 代理商： | LTC4216 |
LTC4216
23
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
4.00
±
0.10
(2 SIDES)
3.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE
DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT,
SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
1.70
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
R = 0.20
TYP
0.25
±
0.05
3.30
±
0.10
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1
NOTCH
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0603
0.25
±
0.05
3.30
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70
±
0.05
(2 SIDES)
2.20
±
0.05
0.50
BSC
0.65
±
0.05
3.50
±
0.05
PACKAGE OUTLINE
MSOP (MS) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90
±
0.152
(.193
±
.006)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
0.50
(.0197)
BSC
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
PACKAGE DESCRIPTIO
U
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC4216CDE | 制造商:Linear Technology 功能描述:Hot Swap Controller 1-CH 6V 12-Pin DFN EP |
| LTC4216CDE#PBF | 功能描述:IC CTLR HOT SWAP 12-DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 類型:熱交換控制器 應(yīng)用:-48V 遠(yuǎn)程電力系統(tǒng)，AdvancedTCA ? 系統(tǒng)，高可用性 內(nèi)部開關(guān):無 電流限制:可調(diào) 電源電壓:11.5 V ~ 14.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件 |
| LTC4216CDE#TR | 制造商:Linear Technology 功能描述:Hot Swap Controller 1-CH 6V 12-Pin DFN EP T/R |
| LTC4216CDE#TRPBF | 功能描述:IC CNTRLR HOT SWAP 12-DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 類型:熱交換控制器 應(yīng)用:-48V 遠(yuǎn)程電力系統(tǒng)，AdvancedTCA ? 系統(tǒng)，高可用性 內(nèi)部開關(guān):無 電流限制:可調(diào) 電源電壓:11.5 V ~ 14.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件 |
| LTC4216CMS | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Ultralow Voltage Hot Swap Controller |
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