參數(shù)資料
型號: LTC6604CUFF-15#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 模擬信號調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PQCC34
封裝: 4 X 7 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-34
文件頁數(shù): 7/16頁
文件大小: 203K
代理商: LTC6604CUFF-15#TRPBF
LT6604-15
15
660415fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
4.00
± 0.10
1.50 REF
7.00
± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
34
33
1
2
BOTTOM VIEW—EXPOSED PAD
6.00 REF
0.75
± 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.25
× 45°
CHAMFER
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFF34) QFN 0807 REV
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
± 0.05
0.25
± 0.05
0.50 BSC
1.50 REF
6.00 REF
6.10
± 0.05
7.50
± 0.05
3.10
± 0.05
4.50
± 0.05
PACKAGE OUTLINE
2.64
± 0.10
1.47
± 0.10
1.90
± 0.10
1.83
± 0.10
1.90
± 0.10
0.99
± 0.10
2.64
± 0.05
1.47
± 0.05
1.90
± 0.05
1.90
± 0.05
1.29
± 0.05
1.83
± 0.05
UFF Package
34-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1758 Rev )
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