2-62 Revision 13 Timing Characteristics Figure 2-33 Output DDR Timing Diagram 11 6 1 7 2" />
參數(shù)資料
型號: M1A3PE3000L-FG484
廠商: Microsemi SoC
文件頁數(shù): 137/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
標準包裝: 40
系列: ProASIC3EL
RAM 位總計: 516096
輸入/輸出數(shù): 341
門數(shù): 3000000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 484-BGA
供應商設(shè)備封裝: 484-FPBGA(23x23)
ProASIC3E DC and Switching Characteristics
2-62
Revision 13
Timing Characteristics
Figure 2-33 Output DDR Timing Diagram
11
6
1
7
2
8
3
910
45
28
3
9
tDDROREMCLR
tDDROHD1
tDDROREMCLR
tDDROHD2
tDDROSUD2
tDDROCLKQ
tDDRORECCLR
CLK
Data_R
Data_F
CLR
Out
tDDROCLR2Q
710
4
Table 2-92 Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
0.70
0.80
0.94
ns
tDDROSUD1
Data_F Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROSUD2
Data_R Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
0.80
0.91
1.07
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.22
0.25
0.30
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.22
0.25
0.30
ns
tDDROCKMPWH
Clock Minimum Pulse Width High for the Output DDR
0.36
0.41
0.48
ns
tDDROCKMPWL
Clock Minimum Pulse Width Low for the Output DDR
0.32
0.37
0.43
ns
FDDOMAX
Maximum Frequency for the Output DDR
1404 1232 1048
MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
相關(guān)PDF資料
PDF描述
ASM44DRXI CONN EDGECARD 88POS DIP .156 SLD
A3PE3000L-FG484 IC FPGA 1KB FLASH 3M 484-FBGA
EMC60DRTS-S734 CONN EDGECARD 120PS DIP .100 SLD
A3PE3000L-FGG484 IC FPGA 1KB FLASH 3M 484-FBGA
AMC25DRYI-S734 CONN EDGECARD 50POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000L-FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000L-FG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA
M1A3PE3000L-FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000L-FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000L-FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA