參數(shù)資料
型號(hào)： M1A3PE3000L-FG484
廠商： Microsemi SoC
文件頁數(shù)： 160/162頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 484-FBGA
標(biāo)準(zhǔn)包裝： 40
系列： ProASIC3EL
RAM 位總計(jì)： 516096
輸入/輸出數(shù)： 341
門數(shù)： 3000000
電源電壓： 1.14V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 484-BGA
供應(yīng)商設(shè)備封裝： 484-FPBGA（23x23）
Revision 13
3-1
3 – Pin Descriptions and Packaging
Supply Pins
GND
Ground
Ground supply voltage to the core, I/O outputs, and I/O logic.
GNDQ
Ground (quiet)
Quiet ground supply voltage to input buffers of I/O banks. Within the package, the GNDQ plane is
decoupled from the simultaneous switching noise originated from the output buffer ground domain. This
minimizes the noise transfer within the package and improves input signal integrity. GNDQ must always
be connected to GND on the board.
VCC
Core Supply Voltage
Supply voltage to the FPGA core, nominally 1.5 V. VCC is required for powering the JTAG state machine
in addition to VJTAG. Even when a device is in bypass mode in a JTAG chain of interconnected devices,
both VCC and VJTAG must remain powered to allow JTAG signals to pass through the device.
VCCIBx
I/O Supply Voltage
Supply voltage to the bank's I/O output buffers and I/O logic. Bx is the I/O bank number. There are up to
eight I/O banks on low power flash devices plus a dedicated VJTAG bank. Each bank can have a
separate VCCI connection. All I/Os in a bank will run off the same VCCIBx supply. VCCI can be 1.5 V,
1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their corresponding VCCI pins tied
to GND.
VMVx
I/O Supply Voltage (quiet)
Quiet supply voltage to the input buffers of each I/O bank. x is the bank number. Within the package, the
VMV plane biases the input stage of the I/Os in the I/O banks. This minimizes the noise transfer within
the package and improves input signal integrity. Each bank must have at least one VMV connection, and
no VMV should be left unconnected. All I/Os in a bank run off the same VMVx supply. VMV is used to
provide a quiet supply voltage to the input buffers of each I/O bank. VMVx can be 1.5 V, 1.8 V, 2.5 V, or
3.3 V, nominal voltage. Unused I/O banks should have their corresponding VMV pins tied to GND. VMV
and VCCI should be at the same voltage within a given I/O bank. Used VMV pins must be connected to
the corresponding VCCI pins of the same bank (i.e., VMV0 to VCCIB0, VMV1 to VCCIB1, etc.).
VCCPLA/B/C/D/E/F
PLL Supply Voltage
Supply voltage to analog PLL, nominally 1.5 V.
When the PLLs are not used, the place-and-route tool automatically disables the unused PLLs to lower
power consumption. The user should tie unused VCCPLx and VCOMPLx pins to ground. Microsemi
recommends tying VCCPLx to VCC and using proper filtering circuits to decouple VCC noise from the
PLLs. Refer to the PLL Power Supply Decoupling section of the "Clock Conditioning Circuits in Low
Power Flash Devices and Mixed Signal FPGAs" chapter of the ProASIC3E FPGA Fabric User’s Guide
for a complete board solution for the PLL analog power supply and ground.
There are six VCCPLX pins on ProASIC3E devices.
VCOMPLA/B/C/D/E/F
PLL Ground
Ground to analog PLL power supplies. When the PLLs are not used, the place-and-route tool
automatically disables the unused PLLs to lower power consumption. The user should tie unused
VCCPLx and VCOMPLx pins to ground.
There are six VCOMPL pins (PLL ground) on ProASIC3E devices.
VJTAG
JTAG Supply Voltage
Low power flash devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run
at any voltage from 1.5 V to 3.3 V (nominal). Isolating the JTAG power supply in a separate I/O bank
gives greater flexibility in supply selection and simplifies power supply and PCB design. If the JTAG
interface is neither used nor planned for use, the VJTAG pin together with the TRST pin could be tied to
GND. It should be noted that VCC is required to be powered for JTAG operation; VJTAG alone is
相關(guān)PDF資料
PDF描述
ASM44DRXI CONN EDGECARD 88POS DIP .156 SLD
A3PE3000L-FG484 IC FPGA 1KB FLASH 3M 484-FBGA
EMC60DRTS-S734 CONN EDGECARD 120PS DIP .100 SLD
A3PE3000L-FGG484 IC FPGA 1KB FLASH 3M 484-FBGA
AMC25DRYI-S734 CONN EDGECARD 50POS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000L-FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
M1A3PE3000L-FG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA
M1A3PE3000L-FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
M1A3PE3000L-FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
M1A3PE3000L-FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*