Revision 13 2-11 Power Consumption of Various Internal Resources Table 2-15 Different Components Contributing" />
參數資料
型號: M1AGLE3000V5-FG896I
廠商: Microsemi SoC
文件頁數: 85/166頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標準包裝: 27
系列: IGLOOe
邏輯元件/單元數: 75264
RAM 位總計: 516096
輸入/輸出數: 620
門數: 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 896-BGA
供應商設備封裝: 896-FBGA(31x31)
IGLOOe Low Power Flash FPGAs
Revision 13
2-11
Power Consumption of Various Internal Resources
Table 2-15 Different Components Contributing to the Dynamic Power Consumption in IGLOOe Devices
For IGLOOe V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Parameter
Definition
Device-Specific Dynamic
Contributions (W/MHz)
AGLE600
AGLE3000
PAC1
Clock contribution of a Global Rib
19.7
12.77
PAC2
Clock contribution of a Global Spine
4.16
1.85
PAC3
Clock contribution of a VersaTile row
0.88
PAC4
Clock contribution of a VersaTile used as a sequential module
0.11
PAC5
First contribution of a VersaTile used as a sequential module
0.057
PAC6
Second contribution of a VersaTile used as a sequential module
0.207
PAC7
Contribution of a VersaTile used as a combinatorial module
0.207
PAC8
Average contribution of a routing net
0.7
PAC9
Contribution of an I/O input pin (standard-dependent)
PAC10
Contribution of an I/O output pin (standard-dependent)
PAC11
Average contribution of a RAM block during a read operation
25.00
PAC12
Average contribution of a RAM block during a write operation
30.00
PAC13
Dynamic contribution for PLL
2.70
Note: For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power
calculator or SmartPower in Libero SoC software.
Table 2-16 Different Components Contributing to the Static Power Consumption in IGLOO Devices
For IGLOOe V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Parameter
Definition
Device Specific Static Power (mW)
AGLE600
AGLE3000
PDC1
Array static power in Active mode
PDC2
Array static power in Static (Idle) mode
PDC3
Array static power in Flash*Freeze mode
PDC4
Static PLL contribution
1.84
PDC5
Bank quiescent power (VCCI-dependent)
PDC6
I/O input pin static power (standard-dependent)
PDC7
I/O output pin static power (standard-dependent)
相關PDF資料
PDF描述
AYM40DRMD CONN EDGECARD 80POS .156 WW
AGM40DRMD CONN EDGECARD 80POS .156 WW
M1AGLE3000V5-FGG896I IC FPGA 1KB FLASH 3M 896-FBGA
11AA040T-I/SN IC EEPROM 4KBIT 100KHZ 8SOIC
EP2SGX60CF780C4 IC STRATIX II GX 60K 780-FBGA
相關代理商/技術參數
參數描述
M1AGLE3000V5-FG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
M1AGLE3000V5-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOOe 標準包裝:1 系列:ProASICPLUS LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:129024 輸入/輸出數:248 門數:600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
M1AGLE3000V5-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOOe 標準包裝:1 系列:ProASICPLUS LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:129024 輸入/輸出數:248 門數:600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
M1AGLE3000V5-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:IGLOOe 標準包裝:1 系列:ProASICPLUS LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:129024 輸入/輸出數:248 門數:600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
M1AGLE3000V5-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology