參數(shù)資料
型號： M1AGLE3000V5-FGG896I
廠商： Microsemi SoC
文件頁數(shù)： 1/166頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝： 27
系列： IGLOOe
邏輯元件/單元數(shù)： 75264
RAM 位總計： 516096
輸入/輸出數(shù)： 620
門數(shù)： 3000000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 896-BGA
供應(yīng)商設(shè)備封裝： 896-FBGA（31x31）
December 2012
I
2012 Microsemi Corporation
IGLOOe Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
Low-Power Active FPGA Operation
Flash*Freeze
Technology
Enables
Ultra-Low
Power
Consumption while Maintaining FPGA Content
Flash*Freeze Pin Allows Easy Entry to / Exit from Ultra-Low-
Power Flash*Freeze Mode
High Capacity
600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 620 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
In-System Programming (ISP) and Security
ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
FlashLock Designed to Secure FPGA Contents
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
Pro (Professional) I/O
700 Mbps DDR, LVDS-Capable I/Os
1.2
V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—Up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold-Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the IGLOOe Family
Clock Conditioning Circuit (CCC) and PLL
Six CCC Blocks, Each with an Integrated PLL
Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
1 kbit of FlashROM User Nonvolatile Memory
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)
True Dual-Port SRAM (except ×18)
ARM Processor Support in IGLOOe FPGAs
M1 IGLOOe Devices—Cortex-M1 Soft Processor Available
with or without Debug
Table 1 IGLOOe Product Family
IGLOOe Devices
AGLE600
AGLE3000
ARM-Enabled IGLOOe Devices
M1AGLE3000
System Gates
600,000
3,000,000
VersaTiles (D-flip-flops)
13,824
75,264
Quiescent Current (typical) in Flash*Freeze Mode (W)
49
137
RAM kbits (1,024 bits)
108
504
4,608-Bit Blocks
24
112
FlashROM Kbits (1,024 bits)
1
Secure (AES) ISP
Yes
CCCs with Integrated PLLs
6
VersaNet Globals 1
18
I/O Banks
8
Maximum User I/Os
270
620
Package Pins
FBGA
FG256, FG484
FG484, FG896
Notes:
1. Refer to the Cortex-M1 Handbook for more information.
2. Six chip (main) and twelve quadrant global networks are available.
3. For devices supporting lower densities, refer to the IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology datasheet.
Revision 13
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