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參數(shù)資料
| 型號(hào)： | M29W400DB45ZA1E |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 4 Mbit (512Kb x8 or 256Kb x16, Boot Block) 3V Supply Flash Memory |
| 中文描述： | 4兆位（512KB的x8或256Kb的x16插槽，引導(dǎo)塊）3V電源快閃記憶體 |
| 文件頁(yè)數(shù)： | 5/22頁(yè) |
| 文件大?。?/td> | 146K |
| 代理商： | M29W400DB45ZA1E |
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M29W400BT, M29W400BB
BUS OPERATIONS
There are five standard busoperations that control
the device. These are Bus Read, Bus Write, Out-
Put Disable, Standby and Automatic Standby. See
Tables 5 and 6, Bus Operations, for a summary.
Typically glitches of less than 5ns on Chip Enable
or Write Enableare ignoredby the memory and do
not affect bus operations.
Bus Read.
Bus Read operations read from the
memory cells, or specific registers in the Com-
mand Interface. A valid Bus Read operation in-
volves setting the desired address on the Address
Inputs, applying a Low signal, V
IL
, to Chip Enable
and Output Enable and keeping Write Enable
High, V
IH
. The Data Inputs/Outputs will output the
value, see Figure 8, Read Mode AC Waveforms,
and Table 14, Read AC Characteristics, for details
of when the output becomes valid.
Bus Write.
Bus Write operations write to the
Command Interface. A valid Bus Write operation
begins by setting the desired address on the Ad-
dress Inputs. The Address Inputs are latched by
the CommandInterface on the falling edge of Chip
Enable or Write Enable, whichever occurs last.
The Data Inputs/Outputs are latched by the Com-
mand Interface on the rising edge of Chip Enable
or WriteEnable, whichever occurs first.OutputEn-
able must remain High, V
IH
, during the whole Bus
Write operation. See Figures 9 and 10, Write AC
Waveforms, and Tables 15 and 16, Write AC
Characteristics, for details of the timing require-
ments.
Output Disable.
The Data Inputs/Outputs are in
the high impedance state when Output Enable is
High, V
IH
.
Standby.
When Chip Enable is High, V
IH
, the
memory enters Standby mode and the Data In-
puts/Outputs pins are placed in the high-imped-
ance state. To reduce the Supply Current to the
Standby Supply Current, I
CC2
, Chip Enableshould
be held within V
CC
±
0.2V. For theStandby current
level see Table 13, DC Characteristics.
During program or erase operations the memory
will continue to use the Program/Erase Supply
Current, I
CC3
, for Programor Erase operations un-
til the operation completes.
Table 5. Bus Operations, BYTE = V
IL
Note: X = V
IL
or V
IH
.
Table 6. Bus Operations, BYTE = V
IH
Note: X = V
IL
or V
IH
.
Operation
E
G
W
Address Inputs
DQ15A–1, A0-A17
Data Inputs/Outputs
DQ14-DQ8
DQ7-DQ0
Bus Read
V
IL
V
IL
V
IH
Cell Address
Hi-Z
Data Output
Bus Write
V
IL
V
IH
V
IL
Command Address
Hi-Z
Data Input
Output Disable
X
V
IH
V
IH
X
Hi-Z
Hi-Z
Standby
V
IH
X
X
X
Hi-Z
Hi-Z
Read Manufacturer
Code
V
IL
V
IL
V
IH
A0 = V
IL
, A1 = V
IL
, A9 = V
ID
,
Others V
IL
or V
IH
Hi-Z
20h
Read Device Code
V
IL
V
IL
V
IH
A0 = V
IH
, A1 = V
IL
, A9 = V
ID
,
Others V
IL
or V
IH
Hi-Z
EEh (M29W400BT)
EFh (M29W400BB)
Operation
E
G
W
Address Inputs
A0-A17
Data Inputs/Outputs
DQ15A–1, DQ14-DQ0
Bus Read
V
IL
V
IL
V
IH
Cell Address
Data Output
Bus Write
V
IL
V
IH
V
IL
Command Address
Data Input
Output Disable
X
V
IH
V
IH
X
Hi-Z
Standby
V
IH
X
X
X
Hi-Z
Read Manufacturer
Code
V
IL
V
IL
V
IH
A0 = V
IL
, A1 = V
IL
, A9 = V
ID
,
Others V
IL
or V
IH
0020h
Read Device Code
V
IL
V
IL
V
IH
A0 = V
IH
, A1 = V
IL
, A9 = V
ID
,
Others V
IL
or V
IH
00EEh (M29W400BT)
00EFh (M29W400BB)
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| M29W400DB45ZA6T | 4 Mbit (512Kb x8 or 256Kb x16, Boot Block) 3V Supply Flash Memory |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M29W400DB45ZE6E | 功能描述:閃存 4 MBIT 3V SUPPLY RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| M29W400DB45ZE6E_NUD | 制造商:Micron Technology Inc 功能描述: |
| M29W400DB45ZE6F | 制造商:Micron Technology Inc 功能描述:PARALLEL NOR - Tape and Reel |
| M29W400DB55N1 | 功能描述:閃存 512Kx8 or 256Kx16 55 RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| M29W400DB55N3T | 功能描述:IC FLASH 4MBIT 55NS 48TSOP RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:Axcell™ 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 同步，DDR II 存儲(chǔ)容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
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