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參數(shù)資料
| 型號： | M36L0R7050B0ZAQT |
| 廠商： | 意法半導體 |
| 英文描述： | CAP 2.2PF 200V 0.5PF C0H DIP-2 BULK S-MIL-C-39014 |
| 中文描述： | 128兆位（多銀行，多層次，突發(fā)）閃存32兆位（200萬× 16）移動存儲芯片，1.8V電源多芯片封裝 |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 406K |
| 代理商： | M36L0R7050B0ZAQT |
17/18
M36L0R7050T0, M36L0R7050B0
REVISION HISTORY
Table 12. Document Revision History
Date
Version
Revision Details
29-Jul-2003
0.1
First Issue
03-Jun-2004
0.2
Package specifications updated. PSRAM component updated in accordance with
M69AR048B datasheet. Flash memory component updated in accordance with
M30L0R7000(T/B)0 datasheet.
Document status changed from Target Specification to Preliminary Data.
04-Dec-2004
1.0
TFBGA88 package fully compliant with the ST ECOPACK specification.
Document status promoted from Preliminary Data to full Datasheet.
Flash memory and PSRAM data updated to the version 1.0 of the M30L0R7000x0
datasheet and to the version 4.0 of the M69AR048B datasheet.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M36L0R7050B0ZAQE | ER 23C 16 12 8 4 SKT RECP WALL |
| M36L0R7050T0ZAQE | AB 6C 2#0 4#4 SKT RECP |
| M36L0R7050T0ZAQT | 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
| M36L0R7050T0ZAQF | 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package |
| M36W108 | 8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M36L0R7050B1ZAQE | 制造商:Micron Technology Inc 功能描述:128M (8MX16) FLASH, 32M PSRAM, 1.8V, TFBGA88, IND, HAZMAT - Trays |
| M36L0R7050B3ZAQE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| M36L0R7050B3ZAQF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| M36L0R7050B4ZAQE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays 制造商:Micron Technology Inc 功能描述:MICM36L0R7050B4ZAQE WIRELESS 制造商:Micron Technology Inc 功能描述:IC FLASH PSRAM 160M |
| M36L0R7050B4ZAQF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
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