參數資料
型號： M36P0R9070E0
廠商： 意法半導體
英文描述： 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
中文描述： 512兆位（x16插槽，多銀行，多層次，多突發(fā)）128兆位閃存（突發(fā)）移動存儲芯片，1.8V電源，多芯片封裝
文件頁數： 24/26頁
文件大?。?/td> 200K
代理商： M36P0R9070E0
7 Part numbering
M36P0R9070E0
24/26
7
Part numbering
Table 11.
Ordering Information Scheme
Note:
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of
available options (Speed, Package, etc.) or for further information on any aspect of this device,
please contact the STMicroelectronics Sales Office nearest to you.
M36
P
0
R
9
0
7
0
E
0
ZAC
E
Example:
Device Type
M36 = Multi-Chip Package (Multiple Flash + PSRAM)
Flash 1 Architecture
P = Multi-Level, Multiple Bank, Large Buffer
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
DDF
= V
CCP
= V
DDQ
= 1.7 to 1.95V
Flash 1 Density
9 = 512 Mbits
Flash 2 Density
0 = No Die
RAM 1 Density
7 = 128 Mbits
RAM 0 Density
0 = No Die
Parameter Blocks Location
E = Even Block Flash Memory Configuration
Product Version
0 = 90nm Flash technology, 93ns speed; PSRAM
Package
ZAC= stacked TFBGA107 C stacked footprint.
Option
Blank = Standard Packing
E = ECOPACK Package, Standard packing
F = ECOPACK Package, Tape & Reel packing
相關PDF資料
PDF描述
M36P0R9070E0ZAC 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36P0R9070E0ZACE 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36P0R9070E0ZACF 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36W0R6030B0 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQ 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
相關代理商/技術參數
參數描述
M36P0R9070E0_06 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package
M36P0R9070E0ZAC 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36P0R9070E0ZACE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays
M36P0R9070E0ZACF 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel
M36P0R9070E1ZACE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數量 廠商 批號 封裝
添加更多采購

我的聯系方式

*
*
*