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參數資料
| 型號： | M7A3P400-FFG256 |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 400000 GATES, 350 MHz, PBGA256 |
| 封裝： | 1 MM PITCH, FBGA-256 |
| 文件頁數： | 225/246頁 |
| 文件大?。?/td> | 3010K |
| 代理商： | M7A3P400-FFG256 |
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ProASIC3/E Flash Family FPGAs
1- 2
v2.1
FPGAs). Therefore, Flash-based ProASIC3 FPGAs do not
require
system
configuration
components
such
as
EEPROMs
or
microcontrollers
to
load
device
configuration data. This reduces bill-of-materials costs
and PCB area, and increases security and system
reliability.
Live at Power-Up
The Actel Flash-based ProASIC3 devices support Level 0
of the LAPU classification standard. This feature helps in
system component initialization, execution of critical
tasks before the processor wakes up, setup and
configuration of memory blocks, clock generation, and
bus activity management. The LAPU feature of Flash-
based ProASIC3 devices greatly simplifies total system
design and reduces total system cost, often eliminating
the need for CPLDs and clock generation PLLs that are
used for these purposes in a system. In addition, glitches
and brownouts in system power will not corrupt the
ProASIC3 device's Flash configuration, and unlike SRAM-
based FPGAs, the device will not have to be reloaded
when system power is restored. This enables the
reduction or complete removal of the configuration
PROM, expensive voltage monitor, brownout detection,
and clock generator devices from the PCB design. Flash-
based ProASIC3 devices simplify total system design and
reduce cost and design risk while increasing system
reliability and improving system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy
neutrons, generated in the upper atmosphere, strike a
configuration cell of an SRAM FPGA. The energy of the
collision can change the state of the configuration cell
and thus change the logic, routing, or I/O behavior in an
unpredictable way. These errors are impossible to
prevent in SRAM FPGAs. The consequence of this type of
error can be a complete system failure. Firm errors do
not exist in the configuration memory of ProASIC3 Flash-
based FPGAs. Once it is programmed, the Flash cell
configuration element of ProASIC3 FPGAs cannot be
altered by high-energy neutrons and is therefore
immune to them. Recoverable (or soft) errors occur in
the user data SRAM of all FPGA devices. These can easily
be mitigated by using error detection and correction
(EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based
ProASIC3
devices
exhibit
power
characteristics similar to an ASIC, making them an ideal
choice for power-sensitive applications. ProASIC3 devices
have only a very limited power-on current surge and no
high-current transition period, both of which occur on
many FPGAs.
ProASIC3
devices
also
have
low
dynamic
power
consumption to further maximize power savings.
Advanced Flash Technology
The ProASIC3 family offers many benefits, including
nonvolatility
and
reprogrammability
through
an
advanced Flash-based, 130-nm LVCMOS process with
seven layers of metal. Standard CMOS design techniques
are used to implement logic and control functions. The
combination of fine granularity, enhanced flexible
routing resources, and abundant Flash switches allows
for very high logic utilization without compromising
device routability or performance. Logic functions within
the device are interconnected through a four-level
routing hierarchy.
Advanced Architecture
The
proprietary
ProASIC3
architecture
provides
granularity comparable to standard-cell ASICs. The
ProASIC3
device
consists
of
five
distinct
and
programmable architectural features (Figure 1-1 and
FPGA VersaTiles
Dedicated FlashROM
Dedicated SRAM/FIFO memory1
Extensive CCCs and PLLs1
Advanced I/O structure
The FPGA core consists of a sea of VersaTiles. Each
VersaTile can be configured as a three-input logic
function, a D-flip-flop (with or without enable), or a
latch by programming the appropriate Flash switch
interconnections. The versatility of the ProASIC3 core tile
as either a three-input lookup table (LUT) equivalent or
as a D-flip-flop/latch with enable allows for efficient use
of the FPGA fabric. The VersaTile capability is unique to
the Actel ProASIC family of third-generation architecture
Flash FPGAs. VersaTiles are connected with any of the
four levels of routing hierarchy. Flash switches are
distributed
throughout
the
device
to
provide
nonvolatile, reconfigurable interconnect programming.
Maximum core utilization is possible for virtually any
design.
In addition, extensive on-chip programming circuitry
allows for rapid, single-voltage (3.3 V) programming of
ProASIC3 devices via an IEEE 1532 JTAG interface.
1. The A3P030 does not support PLL or SRAM.
相關PDF資料 |
PDF描述 |
|---|---|
| M7A3P400-FFG484 | FPGA, 400000 GATES, 350 MHz, PBGA484 |
| M7A3P400-FFGG144 | FPGA, 400000 GATES, 350 MHz, PBGA144 |
| M7A3P400-FFGG256 | FPGA, 400000 GATES, 350 MHz, PBGA256 |
| M7A3P400-FFGG484 | FPGA, 400000 GATES, 350 MHz, PBGA484 |
| M7A3P400-FG144I | FPGA, 400000 GATES, 350 MHz, PBGA144 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| M7A5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MEDIUM CURRENT SILICON RECTIFIERS |
| M7A9 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MEDIUM CURRENT SILICON RECTIFIERS |
| M7AFS600-1FG256 | 制造商:Microsemi Corporation 功能描述:FPGA FUSION 600K GATES 1282.05MHZ 130NM 1.5V 256FBGA - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA FUSION 600K GATES 1282.05MHZ 130NM 1.5V 256FBGA - Trays |
| M7AFS600-1FG256ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Actel Fusion Mixed-Signal FPGAs |
| M7AFS600-1FG256I | 制造商:Microsemi Corporation 功能描述:FPGA FUSION 600K GATES 1282.05MHZ 130NM 1.5V 256FBGA - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA FUSION 600K GATES 1282.05MHZ 130NM 1.5V 256FBGA - Trays |
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