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參數(shù)資料
型號(hào)： MAX9952FCCB+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/24頁(yè)
文件大?。?/td> 0K
描述： IC PMU DUAL 64TQFP
標(biāo)準(zhǔn)包裝： 750
系列： *
MAX9951/MAX9952
Dual Per-Pin Parametric
Measurement Units
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = +12V, VEE = -7V, VL = +3.3V, TA = +25°C, unless otherwise noted. Specifications at TA = TMIN and TA = TMAX are guaranteed
by design and characterization. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to AGND .......................................................................+20V
VEE to AGND.........................................................................-15V
VCC to VEE ...........................................................................+32V
VL to AGND............................................................................+6V
AGND to DGND.....................................................-0.5V to +0.5V
Digital Inputs/Outputs ..................................-0.3V to (VL + 0.3V)
All Other Pins to AGND ....................(VEE - 0.3V) to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
MAX9951_CCB (derate 125mW/°C above +70°C) ...10,000mW
MAX9952_CCB (derate 43.5mW/°C above +70°C) .....3478mW
θJA MAX9951_CCB (Note 1) ...........................................+8°C/W
θJC MAX9951_CCB (Note 1) ...........................................+2°C/W
θJA MAX9952_CCB (Note 1) .........................................+23°C/W
θJC MAX9952_CCB (Note 1) ...........................................+2°C/W
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Operating Temperature Range (commercial) ........0°C to +70°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
Lead(Pb)-Free Packages.............................................+260°C
Packages Containing Lead(Pb)......................................+240°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
FORCE VOLTAGE
Force Input Voltage
Range
VIN0_,
VIN1_
VEE + 2.5
VCC - 2.5
V
VCC = +12V, VEE = -7V
-2
+7
DUT current at full scale
VCC = +18V, VEE = -12V
-7
+13
Forced Voltage
VDUT
DUT current = 0A
VEE + 2.5
VCC - 2.5
V
Input Bias Current
±1
A
Forced-Voltage Offset
VFOS
-25
+25
mV
Forced-Voltage-Offset
Temperature Coefficient
±100
V/°C
Forced-Voltage Gain
Error
VFGE
Nominal gain of +1
-1
0.005
+1
%
Forced-Voltage-Gain
Temperature Coefficient
±10
ppm/°C
Forced-Voltage Linearity
Error
VFLER
Gain and offset errors calibrated out (Notes 3, 4)
-0.02
+0.02
%FSR
MEASURE CURRENT
Measure-Current Offset
IMOS
(Note 3)
-1
+1
%FSR
Measure-Current-Offset
Temperature Coefficient
±20
ppm/°C
Measure-Current Gain
Error
IMGE
(Note 5)
-1
+1
%
Measure-Current-Gain
Temperature Coefficient
±20
ppm/°C
Linearity Error
IMLER
Gain and offset errors calibrated out
(Notes 3, 4, 6)
-0.02
+0.02
%FSR
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
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