參數(shù)資料
型號: MC100LVEL51MNR4G
廠商: ON SEMICONDUCTOR
元件分類: 鎖存器
英文描述: 3.3V ECL Differential Clock D Flip-Flop
中文描述: 100LVEL SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, DSO8
封裝: LEAD FREE, DFN-8
文件頁數(shù): 2/8頁
文件大?。?/td> 140K
代理商: MC100LVEL51MNR4G
MC100LVEL51
http://onsemi.com
2
1
2
3
4
5
6
7
8
Q
V
EE
V
CC
D
Q
CLK
CLK
R
D
R
Flip-Flop
D
L
H
X
R
L
L
H
CLK
Z
Z
X
Q
L
H
L
Z = LOW to HIGH Transition
X = Don’t Care
CLK, CLK
Q, Q
D
R
V
CC
V
EE
EP
ECL Differential Clock Input
ECL Differential Output
ECL D Input
ECL Reset Input
Positive Supp;y
Negative Supply
Exposed pad must be connected to a sufficient
thermal conduit. Electrically connect to the
most negative supply or leave floating open.
Table 1. PIN DESCRIPTION
PIN
FUNCTION
Table 2. TRUTH TABLE
Figure 1. Logic Diagram and Pinout Assignment
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
V
CC
V
EE
V
I
PECL Mode Power Supply
V
EE
= 0 V
V
CC
= 0 V
V
EE
= 0 V
V
CC
= 0 V
Continuous
Surge
8 to 0
V
NECL Mode Power Supply
8 to 0
V
PECL Mode Input Voltage
NECL Mode Input Voltage
V
I
V
I
V
CC
V
EE
6 to 0
6 to 0
V
V
I
out
Output Current
50
100
mA
mA
T
A
T
stg
Operating Temperature Range
40 to +85
°
C
Storage Temperature Range
65 to +150
°
C
JA
Thermal Resistance (Junction
to
Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°
C/W
°
C/W
JC
Thermal Resistance (Junction
to
Case)
Standard Board
8 SOIC
41 to 44
±
5%
°
C/W
JA
Thermal Resistance (Junction
to
Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°
C/W
°
C/W
JC
Thermal Resistance (Junction
to
Case)
Standard Board
8 TSSOP
41 to 44
±
5%
°
C/W
JA
Thermal Resistance (Junction
to
Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°
C/W
°
C/W
T
sol
Wave Solder
Pb
Pb
Free
<2 to 3 sec @ 248
°
C
<2 to 3 sec @ 260
°
C
265
265
°
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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