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| 型號(hào)： | MC13122 |
| 廠商： | Motorola, Inc. |
| 英文描述： | AMAX STEREO IC CHIPSET |
| 中文描述： | 中宇立體聲IC芯片組 |
| 文件頁(yè)數(shù)： | 27/28頁(yè) |
| 文件大?。?/td> | 586K |
| 代理商： | MC13122 |
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MC13027 MC13122
27
MOTOROLA ANALOG IC DEVICE DATA
P SUFFIX
PLASTIC PACKAGE
CASE 710–02
ISSUE B
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC PACKAGE
CASE 751F–04
(SO–28L)
ISSUE E
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
MIN
0.701
0.292
0.093
0.014
0.016
0.050 BSC
MAX
18.05
7.60
2.65
0.49
0.90
MAX
0.711
0.299
0.104
0.019
0.035
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.23
0.13
0
°
10.05
0.25
0.32
0.29
8
°
10.55
0.75
0.009
0.005
0
°
0.395
0.010
0.013
0.011
8
°
0.415
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION.
ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
-A-
-B-
1
14
15
28
-T-
C
SEATING
PLANE
0.010 (0.25)
B
M
M
M
J
-T-
K
26X
G
28X
D
0.010 (0.25)
14X
P
R
X 45
°
F
T
A
B
M
S
S
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
SEATING
PLANE
15
14
28
M
A
B
K
C
N
F
G
D
H
J
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
36.45
13.72
3.94
0.36
1.02
MAX
37.21
14.22
5.08
0.56
1.52
MIN
1.435
0.540
0.155
0.014
0.040
MAX
1.465
0.560
0.200
0.022
0.060
INCHES
MILLIMETERS
2.54 BSC
1.65
0.20
2.92
15.24 BSC
0
0.51
0.100 BSC
0.065
0.008
0.115
0.600 BSC
0
0.020
2.16
0.38
3.43
0.085
0.015
0.135
15
1.02
15
0.040
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