參數(shù)資料
型號： MC33389CDHR2
廠商： Freescale Semiconductor
文件頁數(shù)： 14/49頁
文件大?。?/td> 0K
描述： IC SYSTEM BASE W/CAN 20-HSOP
標(biāo)準(zhǔn)包裝： 750
控制器類型： 系統(tǒng)基礎(chǔ)芯片（SBC），CAN
接口： SPI 串行
電源電壓： 5V
電流 - 電源： 3.5mA
工作溫度： -40°C ~ 125°C
安裝類型： 表面貼裝
封裝/外殼： 20-SOIC（0.433"，11.00mm 寬）裸露焊盤
供應(yīng)商設(shè)備封裝： 20-HSOP
包裝： 帶卷 (TR)
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
33389
FUNCTIONAL DEVICE OPERATION
Figure 6. HSOP-20 Simplified Thermal Model
Example
Assuming IV1 = 100 mA at VBAT = 16 V,
IV2 =150 mA at VBAT = 16 V (Excluding CAN
consumption).
ICAN = 50 mA at VBAT =16 V, we have:
PV1 = 1. 1 W, PV2 = 1.65 W, PCAN = 0.55 W
System assumptions:
If TAMB= 85°C and RTHC/A = 18°C/W, this gives:
TCASE = TAMB+RTHC/A x 3.3 W = 85 + 18 x 3.3 = 145°C
and TJV1 = TJV2 = TJCAN=155°C.
This example represents the limit for the maximum power
dissipation with a HSOP20.
SO28WB Package
The case (pin) to junction RTH is represented here by only
one thermal resistance for the total power because the three
power sources strongly interact on the silicon for such a
package.
Figure 7. SO28WB Simplified Thermal Model
Example
Assuming IV1 = 45 mA at VBAT = 16 V,
IV2 = 45 mA at VBAT = 16 V (Excluding CAN consumption).
ICAN = 50 mA at VBAT = 16 V, we have:
PV1 = 0.5 W, PV2 =0.5 W, PCAN =0.55 W thus PTOTAL
=1.55W
System assumptions:
If TAMB = 85°C and RTHC/A = 25°C/W, this gives:
TCASE = TAMB + RTHC/A x 1.55 W = 85+25 x 1.55 = 124°C
and TJV1 = 124 + 20 x 1.55 = 155°C.
DIFFERENT DEVICE VERSIONS
The MC33389 is proposed in several package versions,
and also offers slight differences in term of functionalities.
The device version is identified in the device part number by
the first letter after the 389 number. The package
identification is done by the last two letters of the part number
(DW for SO28 wide body, DH for power SO20).
T ambient
T case (Heatsink)
V1 Power
V2 Power
CAN Power
TJ (Max 155°C)
RTHJ/C=18°C/W
6.5°C/W
9°C/W
RTHC/A (ECU supplier dependent)
TCASE (pin)
TJ (Max 155°C)
Total Power
RTHC/A
TAMBIENT
RTHJ/C = 20°C/W
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MC33389CDW 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33389CDWR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33389DDW 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC SOW28 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33389DDWR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC SOW28 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MC33390D 功能描述:IC TRANSCEIVER SER LINK 8-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
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