參數(shù)資料
型號(hào): MC33394DH
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 35/44頁(yè)
文件大?。?/td> 0K
描述: IC POWER SUPPLY MULT-OUT 44-HSOP
標(biāo)準(zhǔn)包裝: 30
應(yīng)用: Motorola MPC55x、MPC56x 微處理器
接口: SPI 串行
電源電壓: 4 V ~ 26.5 V
封裝/外殼: 44-BSSOP(0.433",11.00mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 44-HSOP
包裝: 管件
安裝類型: 表面貼裝
33394
40
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
PACKAGE DIMENSIONS
FC SUFFIX
44–LEAD QFN
PLASTIC PACKAGE
CASE 1310–01
ISSUE D
N
PIN 1
INDEX AREA
EXPOSED DIE
ATTACH PAD
6.55
34
11
1
44
6.85
44X 0.23
G
9
B
C
0.1
2X
C
0.1
A
9
33
23
22
12
0.65
M
0.1
C
M
0.05
C
A B
44X
0.75
C
0.1
A B
C
0.1
A B
M
VIEW M–M
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
PACKAGE IS: HF–PQFP–N.
4. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
5. COPLANARITY APPLIES TO LEADS, CORNER
LEADS AND DIE ATTACH PAD.
6. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLE IS 12
°.
40X
DETAIL M
PIN 1 IDENTIFIER
1.0 1.00
0.05
C
0.1
C
0.05
C SEATING PLANE
5
DETAIL G
VIEW ROTATED 90 CLOCKWISE
°
(0.65)
(0.325)
0.8 0.75
0.00
6.55
6.85
0.50
0.37
(3.53)
4
PREFERRED CORNER CONFIGURATION
DETAIL N
(0.25)
4
DETAIL N
CORNER CONFIGURATION OPTION
0.60
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
DETAIL T
PREFERRED BACKSIDE PIN 1 INDEX
(90 )
2X
°
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
0.065
44X
(45 )
°
0.015
2X
0.39
0.31
0.24
0.1
0.0
3.4
0.475
0.425
3.3
BACKSIDE
PIN 1 INDEX
0.25
0.15
R
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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