參數(shù)資料
型號(hào)： MC56F8255VLD
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 71/88頁(yè)
文件大小： 0K
描述： DSC 64K FLASH 60MHZ 44-LQFP
標(biāo)準(zhǔn)包裝： 160
系列： 56F8xxx
核心處理器： 56800E
芯體尺寸： 16-位
速度： 60MHz
連通性： CAN，I²C，LIN，SCI，SPI
外圍設(shè)備： LVD，POR，PWM，WDT
輸入/輸出數(shù)： 35
程序存儲(chǔ)器容量： 64KB（32K x 16）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 4K x 16
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 1x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 105°C
封裝/外殼： 44-LQFP
包裝： 管件
Design Considerations
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
Freescale Semiconductor
73
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a
case-to-ambient thermal resistance.
RθJA = RθJC + RθCA
Eqn. 4
where:
RθJC is device related and cannot be adjusted. You control the thermal environment to change the case to ambient thermal
resistance, RθCA. For instance, you can change the size of the heat sink, the air flow around the device, the interface material,
the mounting arrangement on printed circuit board, or the thermal dissipation on the printed circuit board surrounding the
device.
To determine the junction temperature of the device in the application when heat sinks are not used, the thermal characterization
parameter (
ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of
the package case. Refer to Equation 5.
TJ = TT + (ΨJT x PD)
Eqn. 5
where:
The thermal characterization parameter is measured per JESD51–2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case
of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of
the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to
the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature
and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
8.2
Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard against damage due to high static voltage
or electrical fields. However, take normal precautions to avoid application of any voltages
higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate voltage level.
RθJA
=
Package junction-to-ambient thermal resistance (°C/W)
RθJC
=
Package junction-to-case thermal resistance (°C/W)
RθCA
=
Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
ΨJT
=
Thermal characterization parameter (oC/W)
PD
=
Power dissipation in package (W)
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