參數(shù)資料
型號: MC68HC05J3DW
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PDSO20
封裝: PLASTIC, SOIC-20
文件頁數(shù): 72/92頁
文件大?。?/td> 912K
代理商: MC68HC05J3DW
MOTOROLA
9-2
MC68HC05J3
ELECTRICAL SPECIFICATIONS
9
9.2
Thermal characteristics and power considerations
The average chip junction temperature, TJ, in degrees Celsius can be obtained from the following
equation
:
[1]
where:
TA = Ambient temperature (°C)
θ
JA = Package thermal resistance, junction-to-ambient (°C/W)
PD = PINT + PI/O (W)
PINT = Internal chip power = IDD VDD (W)
PI/O = Power dissipation on input and output pins (User determined)
An approximate relationship between PD and TJ (if PI/O is neglected) is:
[2]
Solving equations [1] and [2] for K gives:
[3]
where K is a constant for a particular part. K can be determined by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained for any value of TA
by solving the above equations. The package thermal characteristics are shown in Table 9-2.
Table 9-2 Package thermal characteristics
Characteristics
Symbol
Value
Unit
Thermal resistance
– 20-pin SOIC package
– 20-pin DIL package
θ
JA
θ
JA
60
°C/W
Figure 9-1 Equivalent test load
T
J
T
A
P
D
θ
JA
(
)
+
=
P
D
K
T
J
273
+
----------------------
=
K
P
D
T
A
273
+
(
)
θ
JA
P
D
2
+
=
Pins
R1
R2
C
PA0–7, PB0–5
3.26k
2.38k
50pF
VDD = 4.5 V
R2
R1
C
Test
point
TPG
71
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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