參數(shù)資料
型號(hào): MC68HSC05C8AFN
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 4.1 MHz, MICROCONTROLLER, PQCC44
封裝: PLASTIC, LCC-44
文件頁數(shù): 28/166頁
文件大小: 1914K
代理商: MC68HSC05C8AFN
Electrical Specifications
Thermal Characteristics
MC68HC05C8A MC68HCL05C8A MC68HSC05C8A — Rev. 5.0
Technical Data
MOTOROLA
Electrical Specifications
123
13.5 Thermal Characteristics
13.6 Power Considerations
The average chip-junction temperature, TJ, in °C, can be obtained from:
TJ = TA + (PD × θJA)(1)
where:
TA = Ambient temperature, °C
θ
JA = Package thermal resistance, junction to ambient, °C/W.
PD = PINT + PI/O
PINT = IDD × VDD watts (chip internal power)
PI/O = Power dissipation on input and output pins (user-determined)
For most applications PI/O PINT and can be neglected.
Following is an approximate relationship between PD and TJ (neglecting
PI/O):
PD = K ÷ (TJ + 273 °C)
(2)
Solving equations (1) and (2) for K gives:
K = PD × (TA + 273 °C) + θJA × (PD)
2
(3)
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring PD (at equilibrium) for a
known TA. Using this value of K, the values of PD and TJ can be obtained
by solving equations (1) and (2) iteratively for any value of TA.
Characteristic
Symbol
Value
Unit
Thermal resistance
Plastic dual in-line package
Plastic leaded chip carrier (PLCC)
Quad flat pack (QFP0)
Plastic shrink DIP (SDIP)
θJA
60
70
95
60
°C/W
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