參數(shù)資料
型號: MC8641HX1000NE
廠商: Freescale Semiconductor
文件頁數(shù): 39/130頁
文件大?。?/td> 0K
描述: IC DUAL CORE PROCESSOR 994-CBGA
標準包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.0GHz
電壓: 0.95V
安裝類型: 表面貼裝
封裝/外殼: 994-BCBGA,F(xiàn)CCBGA
供應商設備封裝: 994-FCCBGA(33x33)
包裝: 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
16
Freescale Semiconductor
Power Characteristics
The power dissipation for the MPC8641 single core device is shown in Table 6.
Table 6. MPC8641 Power Dissipation (Single Core)
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD_Coren,
VDD_PLAT
(Volts)
Junction
Temperature
Power
(Watts)
Notes
Typical
1500 MHz
600 MHz
1.1 V
65 oC
20.3
1, 2
Thermal
105 oC
25.2
1, 3
Maxim
28.9
1, 4
Typical
1333 MHz
533 MHz
1.05 V
65 oC
16.3
1, 2
Thermal
105 oC
20.2
1, 3
Maximum
23.2
1, 4
Typical
1250 MHz
500 MHz
1.05 V
65 oC
16.3
1, 2
Thermal
105 oC
20.2
1, 3
Maximum
23.2
1, 4
Typical
1000 MHz
400 MHz
1.05 V
65 oC
16.3
1, 2
Thermal
105 oC
20.2
1, 3
Maximum
23.2
1, 4
Typical
1000 MHz
500 MHz
0.95 V,
1.05 V
65 oC
11.6
1, 2, 5
Thermal
105 oC
14.4
1, 3, 5
Maximum
16.5
1, 4, 5
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Coren) and 65°C junction
temperature (see Table 2)while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz.
3. Thermal power is the average power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz and a typical
workload on platform interfaces.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy.
5. These power numbers are for Part Number MC8641xx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
相關PDF資料
PDF描述
MPC8572LPXATLD MPU POWERQUICC III 1023-PBGA
396-020-541-804 CARD EDGE 20POS DL .125X.250 BLK
396-020-541-802 CARD EDGE 20POS DL .125X.250 BLK
MPC8572LPXARLD MPU POWERQUICC III 1023-PBGA
396-020-541-204 CARD EDGE 20POS DL .125X.250 BLK
相關代理商/技術參數(shù)
參數(shù)描述
MC8641HX1250G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641HX1250H 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641HX1250HB 功能描述:微處理器 - MPU G8 REV 2.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8641HX1250HC 功能描述:IC MPU SGL E600 CORE 994FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC86xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設備封裝:783-FCPBGA(29x29) 包裝:托盤
MC8641HX1250J 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications