參數(shù)資料
型號(hào)： MCF52235
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： ColdFire Microcontroller
中文描述： ColdFire微控制器
文件頁(yè)數(shù)： 30/50頁(yè)
文件大?。?/td> 656K
代理商： MCF52235
MCF52235 ColdFire Microcontroller, Rev. 3
Preliminary Electrical Characteristics
Freescale Semiconductor
30
Junction to ambient (@200 ft/min)
θ
JMA
80-pin LQFP, four-layer board
30.0
°
C / W
112-pin LQFP, four-layer board
29.0
121 MAPBGA, four-layer board
28
80-pin LQFP, one-layer board
1
39.0
1
112-pin LQFP, one-layer board
1
35.0
1
121 MAPBGA, one-layer board
1
46
1
Junction to board
θ
JB
80-pin LQFP
22.0
4
°
C / W
112-pin LQFP
23.0
121 MAPBGA, four-layer board
18
Junction to case
θ
JC
80-pin LQFP
6.0
5
°
C / W
112-pin LQFP
6.0
121 MAPBGA
10
Junction to top of package, natural convection
Ψ
jt
80-pin LQFP
2.0
6
°
C / W
112-pin LQFP
2.0
6
121 MAPBGA
2.0
6
Maximum operating junction temperature
T
j
All
130
o
C
1
The use of this device in one- or two-layer board designs is not recommended due to the limited thermal conductance
provided by those boards.
2
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JMA
and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
3
Per JEDEC JESD51-6 with the board horizontal.
4
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
Table 20. Thermal Characteristics (continued)
Characteristic
Symbol
Package
1
Value
Unit
相關(guān)PDF資料
PDF描述
MCF5232CAB80 Integrated Microprocessor Hardware Specification
MCF5232 Integrated Microprocessor Hardware Specification
MCF5249 CodeWarrior Development Studio for ColdFire㈢ Architectures
MCF5251_07 ColdFire㈢ Microprocessor Data Sheet
MCF5251 ColdFire Processor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF52235_06 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microcontroller
MCF52235_07 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Microcontroller
MCF52235_10 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MCF52235 ColdFire Microcontroller Data Sheet
MCF52235CAL60 功能描述:32位微控制器 - MCU KIRIN2E EPP RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF52235CAL60A 制造商:Freescale Semiconductor 功能描述:KIRIN2E EPP - REV A - Bulk
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