參數(shù)資料
型號: MCF53016CMJ240J
廠商: Freescale Semiconductor
文件頁數(shù): 21/62頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 128KB 256MAPBGA
標(biāo)準(zhǔn)包裝: 450
系列: MCF5301x
核心處理器: Coldfire V3
芯體尺寸: 32-位
速度: 240MHz
連通性: EBI/EMI,以太網(wǎng),I²C,MMC,SPI,SSI,UART/USART,USB,USB OTG
外圍設(shè)備: DMA,PWM,WDT
輸入/輸出數(shù): 83
程序存儲器容量: 16KB(16K x 8)
程序存儲器類型: 緩存
RAM 容量: 128K x 8
電壓 - 電源 (Vcc/Vdd): 1.08 V ~ 3.6 V
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 256-LBGA
包裝: 托盤
MCF5301x Data Sheet, Rev. 5
Preliminary—Subject to Change Without Notice
Preliminary Electrical Characteristics
Freescale Semiconductor
28
read cycles. Care must be taken during board design to adhere to the following guidelines and specs with regard to the
SD_SDR_DQS signal and its usage.
Table 13. SDR Timing Specifications
Symbol
Characteristic
Symbol
Min
Max
Unit
Notes
Frequency of operation
50
80
Mhz
1
The device supports same frequency of operation for both FlexBus and SDRAM clock operates as that of the internal bus clock.
Please see the PLL chapter of the MCF5301x Reference Manual for more information on setting the SDRAM clock rate.
SD1
Clock period
tSDCK
12.5
20
ns
2
SD_CLK is one SDRAM clock in (ns).
SD2
Pulse width high
tSDCKH
0.45
0.55
SD_CLK
3
Pulse width high plus pulse width low cannot exceed min and max clock period.
SD3
Pulse width low
tSDCKH
0.45
0.55
SD_CLK
4
Pulse width high plus pulse width low cannot exceed min and max clock period.
SD4
Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA,
SD_CS[1:0] output valid
tSDCHACV
—0.5
× SD_CLK
+1.0
ns
SD5
Address, SD_CKE, SD_CAS, SD_RAS, SD_WE, SD_BA,
SD_CS[1:0] output hold
tSDCHACI
2.0
ns
SD6
SD_SDR_DQS output valid
tDQSOV
Self timed
ns
5
SD_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This is a guideline only. Subtle variation
from this guideline is expected. SD_DQS will only pulse during a read cycle and one pulse will occur for each data beat.
SD7
SD_DQS[3:0] input setup relative to SD_CLK
tDQVSDCH
0.25
×
SD_CLK
0.40
× SD_CLK
ns
6
SDR_DQS is designed to pulse 0.25 clock before the rising edge of the memory clock. This spec is a guideline only. Subtle
variation from this guideline is expected. SDR_DQS will only pulse during a read cycle and one pulse will occur for each data
beat.
SD8
SD_DQS[3:2] input hold relative to SD_CLK
tDQISDCH
Does not apply. 0.5
×SD_CLK fixed
width.
7
The SDR_DQS pulse is designed to be 0.5 clock in width. The timing of the rising edge is most important. The falling edge does
not affect the memory controller.
SD9
Data (D[31:0]) input setup relative to SD_CLK (reference
only)
tDVSDCH
0.25
×
SD_CLK
—ns
8
Since a read cycle in SDR mode still uses the DQS circuit within the device, it is most critical that the data valid window be
centered 1/4 clk after the rising edge of DQS. Ensuring that this happens will result in successful SDR reads. The input setup
spec is just provided as guidance.
SD10
Data input hold relative to SD_CLK (reference only)
tDISDCH
1.0
ns
SD11
Data (D[31:0]) and data mask (SD_DQM[3:0]) output valid
tSDCHDMV
—0.75
× SD_CLK
+ 0.5
ns
SD12
Data (D[31:0]) and data mask (SD_DQM[3:0]) output hold
tSDCHDMI
1.5
ns
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