參數(shù)資料
型號: MCP6033T-E/MS
廠商: Microchip Technology
文件頁數(shù): 25/34頁
文件大?。?/td> 0K
描述: IC OPAMP SNGL 1.8V W/CS 8MSOP
標準包裝: 2,500
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.004 V/µs
增益帶寬積: 10kHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 150µV
電流 - 電源: 0.9µA
電流 - 輸出 / 通道: 23mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 帶卷 (TR)
其它名稱: MCP6033T-E/MSTR
2008 Microchip Technology Inc.
DS22041B-page 31
MCP6031/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Device:
MCP6031:
Single Op Amp
MCP6031T:
Single Op Amp (Tape and Reel)
MCP6032:
Dual Op Amp
MCP6032T:
Dual Op Amp (Tape and Reel)
MCP6033:
Single Op Amp with Chip Select
MCP6033T:
Single Op Amp with Chip Select
(Tape and Reel)
MCP6034:
Quad Op Amp
MCP6034T:
Quad Op Amp (Tape and Reel)
Temperature Range:
E
= -40°C to +125°C
Package:
MC = Plastic Dual Flat, No Lead, (2x3 DFN ) 8-lead **
MS = Plastic MSOP, 8-lead
OT = Plastic Small Outline Transistor, 5-lead *
SL
= Plastic SOIC (150 mil Body), 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
ST
= Plastic TSSOP (4.4mm Body), 14-lead
* This package is only available on the MCP6031 device.
** These packages are only available on the MCP6031 and
MCP6033 devices.
PART NO.
X
/XX
Package
Temperature
Range
Device
Examples:
a)
MCP6031-E/SN:
8LD SOIC package.
b)
MCP6031T-E/SN: Tape and Reel,
8LD SOIC package.
c)
MCP6031-E/MS:
8LD MSOP package.
d)
MCP6031T-E/MS: Tape and Reel,
8LD MSOP package.
e)
MCP6031-E/MC:
8LD DFN package.
f)
MCP6031T-E/MC: Tape and Reel,
8LD DFN package.
g)
MCP6031T-E/OT: Tape and Reel,
5-LD SOT-23 package.
a)
MCP6032-E/SN:
8LD SOIC package.
b)
MCP6032T-E/SN: Tape and Reel,
8LD SOIC package.
c)
MCP6032-E/MS:
8LD MSOP package
d)
MCP6032T-E/MS: Tape and Reel
8LD MSOP package.
a)
MCP6033-E/SN:
8LD SOIC package.
b)
MCP6033T-E/SN: Tape and Reel,
8LD SOIC package.
c)
MCP6033-E/MS:
8LD MSOP package.
d)
MCP6033T-E/MS: Tape and Reel,
8LD MSOP package.
e)
MCP6033-E/MC:
8LD DFN package.
f)
MCP6033T-E/MC: Tape and Reel,
8LD DFN package.
a)
MCP6034-E/SL:
14LD SOIC package.
b)
MCP6034T-E/SL: Tape and Reel,
14LD SOIC package.
c)
MCP6034-E/ST:
14LD TSSOP package.
d)
MCP6034T-E/ST: Tape and Reel,
14LD TSSOP package.
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