參數(shù)資料
型號(hào)： MCV14AI/P
元件分類： 微控制器/微處理器
英文描述： 8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDIP14
封裝： 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-14
文件頁數(shù)： 77/84頁
文件大小： 1007K
代理商： MCV14AI/P
2009 Microchip Technology Inc.
Preliminary
DS41338B-page 77
MCV14A
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
1.27 BSC
Overall Height
A
–
1.75
Molded Package Thickness
A2
1.25
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
NOTE 1
N
D
E
E1
1
23
b
e
A
A1
A2
L
L1
c
h
α
β
φ
Microchip Technology Drawing C04-065B
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