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參數(shù)資料
| 型號(hào)： | MCZ33399EF |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Local Interconnect Network (LIN) Physical Interface |
| 中文描述： | 本地互連網(wǎng)絡(luò)（LIN）物理接口 |
| 文件頁(yè)數(shù)： | 4/19頁(yè) |
| 文件大?。?/td> | 234K |
| 代理商： | MCZ33399EF |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
4
33399
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Continuous Supply Voltage
Transient Voltage (Load Dump)
V
SUP
27
40
V
WAKE DC and Transient Voltage (Through a 33 k
Serial Resistor)
V
WAKE
- 18 to 40
V
Logic Voltage (RXD, TXD, EN Pins)
V
LOG
- 0.3 to 5.5
V
LIN Pin
DC Voltage
Transient (Coupled Through 1.0 nF Capacitor)
V
BUS
- 18 to 40
- 150 to 100
V
INH Voltage Current
DC Voltage
V
INH
- 0.3 to V
SUP
+ 0.3
V
ESD Voltage, Human Body Model
(1)
All Pins
LIN Bus Pin with Respect to Ground
V
ESD1
± 4000
± 5000
V
ESD Voltage, Machine Model
All Pins
V
ESD2
± 200
V
Operating Temperature
Ambient
Junction
T
A
T
J
- 40 to 125
- 40 to 150
°
C
Storage Temperature
T
STG
- 55 to 165
°
C
Thermal Resistance
,
Junction to Ambient
R
θ
JA
150
°
C/W
Peak Package Reflow Temperature During Reflow
(2)
,
(3)
T
PPRT
Note 3.
°C
Thermal Shutdown
T
SHUT
150 to 200
°
C
Thermal Shutdown Hysteresis
T
HYST
8.0 to 20
°
C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 220 pF, R
ZAP
= 0
).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
2.
3.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCZ33399EFR2 | 功能描述:輸入/輸出控制器接口集成電路 LIN INTERFACE RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray |
| MCZ33661EF | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC ENHANCED LIN INTERFACE RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33661EF | 制造商:Freescale Semiconductor 功能描述:IC INTERFACE PHYSICAL LINE 8SOIC |
| MCZ33661EFR2 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC ENHANCED LIN INTERFACE RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33661EFR2 | 制造商:Freescale Semiconductor 功能描述:IC LIN INTERFACE 制造商:Freescale Semiconductor 功能描述:IC, LIN INTERFACE |
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