DYNAMIC ELECTRICAL CHARACTERISTICS STATE MAC" />
參數(shù)資料
型號(hào): MCZ33742SEG
廠商: Freescale Semiconductor
文件頁數(shù): 10/71頁
文件大?。?/td> 0K
描述: IC SYSTEM BASIS CHIP CAN 28-SOIC
標(biāo)準(zhǔn)包裝: 26
應(yīng)用: 自動(dòng)
電流 - 電源: 42mA
電源電壓: 5.5 V ~ 18 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 28-SOIC W
包裝: 管件
Analog Integrated Circuit Device Data
18
Freescale Semiconductor
33742
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
STATE MACHINE TIMING (CS, SCLK, MOSI, MISO, WDOG, INT) (CONTINUED)
Delay Between SPI Command and HS Turn ON(33)
Normal or Standby mode, VSUP > 9.0 V
tS-HSON
22
s
Delay Between SPI Command and HS Turn OFF(33)
Normal or Standby mode, VSUP > 9.0 V
tS-HSOFF
22
s
Delay Between SPI and V2 Turn ON(33)
Standby mode
tS-V2ON
9.0
22
s
Delay Between SPI and V2 Turn OFF(33)
Normal mode
tS-V2OFF
9.0
22
s
Delay Between Normal Request and Normal mode After Watchdog Trigger
Command(33)
Normal Request mode
tS-NR2N
15
35
70
s
STATE MACHINE TIMING (CS, SCLK, MOSI, MISO, WDOG, INT) (CONTINUED)
Delay Between SPI and CAN Normal mode(34)
Normal mode(35)
tS-CAN_N
10
s
Delay Between SPI and CAN Sleep Mode(34)
Normal mode (35)
tS-CAN_S
10
s
Delay Between CS Wake-up (CS LOW to HIGH) and Device in Normal
Request mode (VDD ON and RST HIGH)
Stop mode
tW-CS
15
40
90
s
Delay Between CS Wake-up (CS LOW to HIGH) and First Accepted SPI
Command
Device in Stop mode After Wake-up
tW-SPI
90
N/A
s
Delay Between INT Pulse and First SPI Command Accepted
Device in Stop mode After Wake-up
tS-1STSPI
20
N/A
s
Delay Between Two SPI Messages Addressing the Same Register
t2SPI
25
s
OUTPUT PIN (VDD)
Reset Delay Time
Measured at 50% of Reset Signal
tD
4.0
30
s
IDD Over-current to Wake-up Deglitcher Time(35)
tIDD-DGLT
40
55
75
s
Notes
33.
Delay starts at falling edge of clock cycle #8 of the SPI command and start of “Turn ON” or “Turn OFF” of HS or V2.
34.
Delay starts at falling edge of clock cycle #8 of the SPI command and start of “Turn ON” or “Turn OFF” of HS or V2.
35.
Guaranteed by design; it is not production tested.
Table 6. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V
V2 5.25 V, 5.5 V VSUP 18 V, and -40 C TA 125 C. Typical values
noted reflect the approximate parameter mean at TA = 25 C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
相關(guān)PDF資料
PDF描述
EEM28DRYN CONN EDGECARD 56POS DIP .156 SLD
837975-3 LGH-3 LEAD ELECT MLD END
S1210R-101K INDUCTOR SHIELDED .10UH SMD
MCZ33689DEWR2 IC SYSTEM BASIS CHIP LIN 32-SOIC
EEM28DRYH CONN EDGECARD 56POS DIP .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCZ33742SEGR2 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-E-HS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
MCZ33780EG 功能描述:多路器開關(guān) IC DBUS MASTER RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻(最大值):7 Ohms 開啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
MCZ33780EG 制造商:Freescale Semiconductor 功能描述:DUAL DBUS MASTER INTERFACE 16SOIC
MCZ33780EGR2 功能描述:多路器開關(guān) IC DBUS MASTER RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻(最大值):7 Ohms 開啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
MCZ33781EK 功能描述:輸入/輸出控制器接口集成電路 DBUS2 MASTER STND RoHS:否 制造商:Silicon Labs 產(chǎn)品: 輸入/輸出端數(shù)量: 工作電源電壓: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-64 封裝:Tray