參數(shù)資料
型號: MCZ33797EK
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Four Channel Squib Driver IC
中文描述: 四通道爆管驅(qū)動IC
文件頁數(shù): 5/34頁
文件大小: 290K
代理商: MCZ33797EK
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33797
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
INPUT ELECTRICAL RATINGS
Voltage on VDD
V
DD
7.0
V
Voltage on Input pins CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,
R_DIAG, R_LIMIT_X
V
I
-0.3 to V
DD
+ 0.3
V
Voltage on Squib pins SQB_HI_XX, SQB_LO_XX, SENSE_XX
V
VFIRE_XX
-0.3 to V
VFIRE
+ 0.3
V
Voltage on pins VDIAG_X, VFIRE_XX
VDIAG_X
-0.3 to 35
V
ESD Voltage
(1)
Human Body Model
Machine Model
V
ESD1
V
ESD2
±2000
±200
V
Maximum V
VFIRE
with Pulsed Output
(2)
,
(3)
R
SQUIB
= 2.0
, t
ON
= 0.8 ms, I
SQUIB
= 2.24 A
R
SQUIB
= 1.2
, t
ON
= 0.8 ms, I
SQUIB
= 2.24 A
R
SQUIB
= 0.1
, t
ON
= 0.60 ms, I
SQUIB
= 2.24 A
V
FPULSE
35
25
25
V
THERMAL RATINGS
Storage Temperature
T
STG
155
°
C
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t
5.0 ms (Post-Squib Deployment)
T
A
T
JCONT
T
JDPYD
85
100
300
°
C
Peak Package Reflow Temperature During Reflow
(4)
,
(5)
T
PPRT
Note 5.
°C
Thermal Resistance (Junction-to-Ambient)
R
θ
J-A
74
°
C/W
Notes
1
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1.
The FET squib driver can be activated through the
arm ire command when the TEMP
RENABLE
(MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15
± 0.15
.
Shorted squib load is 0.1
.
Three-squib driver with R
SQUIB
= 0.1
conditions. Remaining squib driver conditions: R
SQUIB
= 1.2
, t
ON
= 4.0 ms, I
SQUIB
= 2.0 A,
V
VDIAG_X
= V
VFIRE_XX
= 35 V.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
2
3
4
5.
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