參數(shù)資料
型號(hào): MF1S5035DUD
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development
封裝: MF1S5030DA3<SOT500|<<<1<Always Pb-free,;MF1S5030DA4<SOT500-2 (PLLMC)|<<http://www.nxp.com/packages/SOT500-2.html<1<Always Pb-free,;MF1S5030DA6<SOT500-3 (PLLMC)|&
文件頁數(shù): 29/37頁
文件大?。?/td> 425K
代理商: MF1S5035DUD
MF1S503x
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.1 — 21 February 2011
194031
29 of 37
NXP Semiconductors
MF1S503x
MIFARE Classic 1K - Mainstream contactless smart card IC
15. Bare die outline
Fig 22. Bare die outline and chip orientation MF1S5035
001aan012
VSS
LA
TESTIO
LB
Chip Step
Pad size
LA, LB, VSS
TESTIO
90
75
90
90
x (
μ
m)
y (
μ
m)
LA, LB, VSS
TESTIO
104
89
104
104
1062
(1)
1012
(1)
Y
X
typ. 27.0
(1)
min. 5.0
793.7
196.8
166.5
401.3
149.1
861.5
typ. 1062.0
(1)
typ.
1012.0
(1)
799.4
typ. 27.0
(1)
min. 5.0
Note
1. The air gap and thus the step size may vary due to varying foil expansion
2. All dimensions in
μ
m, pad locations measured from outher sealring edge (see detail)
(2)
MF1S5035
Bump size
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