參數(shù)資料
型號(hào): MPC2106CDG66
廠商: MOTOROLA INC
元件分類(lèi): SRAM
英文描述: 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
中文描述: 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA178
文件頁(yè)數(shù): 19/20頁(yè)
文件大?。?/td> 245K
代理商: MPC2106CDG66
MPC2105A
MPC2106A
MPC2105B
MPC2106B
19
MOTOROLA FAST SRAM
178 LEAD CARD EDGE
MPC2106A/B
CASE 1132–01
ééééééééééééé
ééééééééééééé
ééééééééééééé
éééé
R
D6
A
D5
é
éé
éé
R
éé
éé
ééééé
ééééé
éé
éé
é
é
é
é
éé
éé
C
D
A
A1
2X
D2
2X
C
M
0.006
B
L
A
D3
B
M
0.006
D4
C
L
A
VIEW A
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN INCHES.
3. CARD THICKNESS APPLIES ACROSS TABS AND
INCLUDES PLATING AND/OR METALLIZATION.
4. DIMENSIONS E AND A5 DEFINE A
DOUBLE–SIDED MODULE.
5. DIMENSION E1 DEFINES OPTIONAL
SINGLE–SIDED MODULE.
6. STRAIGHTNESS CALLOUT APPLIES TO TAB
AREA ONLY.
DIM
A
A1
A2
A3
A4
A5
b
D
D1
D2
D3
D4
D5
D6
D7
e
e1
E
E1
E2
MIN
1.390
0.545
0.095
–––
0.195
0.195
0.039
5.055
0.100
0.190
1.255
3.405
1.250 BSC
0.072
0.075
0.050 BSC
0.075 BSC
–––
–––
0.055
MAX
1.410
–––
–––
0.010
–––
–––
0.043
5.065
–––
–––
1.265
3.410
INCHES
0.076
0.081
0.210
0.140
0.070
D7
VIEW A
FRONT VIEW
B
D1
2X
B
L
0.006
C
L
A
4X
VIEW A
C
A2
A3
A4
b
178X
86X
e
e1
1
ééééééééééééé
ééééééééééééé
ééééééééééééé
ééééééééééééé
BACK VIEW
47
48
1
24
25
47
48
89
COMPONENT
AREA
COMPONENT
C
A5
NOTE 4
E1
NOTE 5
M
0.016
E2
NOTES 3 AND 6
SIDE VIEW
E
相關(guān)PDF資料
PDF描述
MPC2106BSG66 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC2107SG15 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC2105PDG66 256KB/512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC2104 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC2104SG66 256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC2106SG66 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC2107SG15 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms
MPC214G100 制造商:FDY 功能描述:AF421X100 SPECIAL .215 G120
MPC-214G100 制造商:FDY 功能描述:AF421X100 SPECIAL .215 G120
MPC222225T 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.866"; External Width - Metric:22mm; External Length - Imperial:0.866"; Heat Sink Material:Ceramic;RoHS Compliant: Yes