型號: | MPC2106CDG66 |
廠商: | MOTOROLA INC |
元件分類: | SRAM |
英文描述: | 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
中文描述: | 128K X 72 CACHE SRAM MODULE, 9 ns, PDMA178 |
文件頁數(shù): | 20/20頁 |
文件大小: | 245K |
代理商: | MPC2106CDG66 |
相關(guān)PDF資料 |
PDF描述 |
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MPC2106BSG66 | 512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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MPC2106SG66 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
MPC2107SG15 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms |
MPC214G100 | 制造商:FDY 功能描述:AF421X100 SPECIAL .215 G120 |
MPC-214G100 | 制造商:FDY 功能描述:AF421X100 SPECIAL .215 G120 |
MPC222225T | 制造商:AMEC THERMASOL 功能描述:HEAT SINK CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK, CERAMIC 22*22*2.5 STD ADHESIV 制造商:AMEC THERMASOL 功能描述:HEAT SINK; Thermal Resistance:10.21C/W; External Height - Imperial:0.098"; External Height - Metric:2.5mm; External Width - Imperial:0.866"; External Width - Metric:22mm; External Length - Imperial:0.866"; Heat Sink Material:Ceramic;RoHS Compliant: Yes |