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參數(shù)資料
| 型號： | MPC5553MZQ132 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 66/68頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU MPC5553 REV A 324-PBGA |
| 產(chǎn)品培訓模塊： | MPC55xx PitchPak Family |
| 標準包裝： | 60 |
| 系列： | MPC55xx Qorivva |
| 核心處理器： | e200z6 |
| 芯體尺寸： | 32-位 |
| 速度： | 132MHz |
| 連通性： | CAN，EBI/EMI，以太網(wǎng)，SCI，SPI |
| 外圍設(shè)備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 220 |
| 程序存儲器容量： | 1.5MB（1.5M x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 40x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 324-BBGA |
| 包裝： | 托盤 |
| 配用： | MPC5553EVBISYS-ND - KIT EVAL ISYSTEMS MPC5553 MPC5553EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE MPC5553EVB-ND - KIT EVAL MPC5553MZP132 MPC5553EVBE-ND - BOARD EVAL FOR MPC5553 |
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Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
7
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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