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參數(shù)資料
| 型號： | MPC5554MZP80 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 55/58頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 32BIT 2MB FLASH 416PBGA |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | MPC55xx Qorivva |
| 核心處理器： | e200z6 |
| 芯體尺寸： | 32-位 |
| 速度： | 82MHz |
| 連通性： | CAN，EBI/EMI，SCI，SPI |
| 外圍設(shè)備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 256 |
| 程序存儲器容量： | 2MB（2M x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 40x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 416-BBGA |
| 包裝： | 托盤 |
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MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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| MPC5554MZP80R2 | 制造商:Freescale Semiconductor 功能描述:MPC5554 COPPERHEAD - Tape and Reel |
| MPC555CME | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC555 EVAL KIT Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC555CMEE | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC555 EVAL KIT Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC555D | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:This document provides an overview of the MPC555 microcontroller, including a block diagram showing the major modular components and sections that lis |
| MPC555LFAVR40 | 功能描述:32位微控制器 - MCU MPC555 448K FLASH Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
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