參數(shù)資料
型號(hào): MPC603AFE66AC
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 11/31頁
文件大?。?/td> 153K
代理商: MPC603AFE66AC
603 Hardware Specifications
19
1.7.2 IBM C4-CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the IBM C4-CQFP
package.
1.7.2.1 Package Parameters
The package parameters for the IBM C4-CQFP are as provided in the following list. The package type is
32 mm x 32 mm, 240-pin ceramic quad at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm
Lead plating
Ni Au
Solder joint
Sn/PB (10/90)
Lead encapsulation
Epoxy
Solder-bump encapsulation
Epoxy
Maximum module height
3.1 mm
Co-planarity specication
0.08 mm
Note: No solvent can be used with the C4-CQFP package. See Appendix A, “General Handling
Recommendations for the C4-CQFP Package,” for details.
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