- 您現(xiàn)在的位置：買賣IC網 > PDF目錄45344 > MPC603AFE66AC (FREESCALE SEMICONDUCTOR INC) 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 PDF資料下載
參數(shù)資料
| 型號： | MPC603AFE66AC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 20/31頁 |
| 文件大小： | 153K |
| 代理商： | MPC603AFE66AC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁當前第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁
603 Hardware Specifications
27
Figure 16. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30 °C + 5 °C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 66
°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common gure-
of-merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when only using this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat ow. The nal die-junction operating
temperature, is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the nal operating die-junction temperature—airow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several “compact”
thermal-package models are available within FLOTHERM. These are available upon request.
1
2
3
4
5
6
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
(25 x 28 x 15 mm)
Heat
Sink
Thermal
Resistance
(
°C/W)
Approach Airflow Velocity
(m/s)
Approach Airow Velocity (m/s)
Heat
Sink
Thermal
Resistance
(
°C/W)
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.
相關PDF資料 |
PDF描述 |
|---|---|
| MPC603AFE80CC | RISC PROCESSOR, CQFP240 |
| MPC603AFE66CC | RISC PROCESSOR, CQFP240 |
| MPC603AIP200E | 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288 |
| MPC603CIP200D | 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288 |
| MPC603DIM266E | 32-BIT, 266 MHz, RISC PROCESSOR, CPGA288 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC603AFE80CB | 制造商:Motorola Inc 功能描述: |
| MPC603E | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| MPC603E7TEC | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| MPC603E7TED | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
| mpc603efe100ln | 制造商: 功能描述: 制造商:undefined 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。