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參數(shù)資料
| 型號： | MPC603AFE66AC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 66.67 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 9/31頁 |
| 文件大小： | 153K |
| 代理商： | MPC603AFE66AC |
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603 Hardware Specifications
17
1.7 PowerPC 603 Microprocessor Package
Description
The following sections provide the package parameters and the mechanical dimensions for the 603. Note
that the 603 is currently offered in two types of CQFP packages—the Motorola wire-bond CQFP and the
IBM C4-CQFP.
1.7.1 Motorola Wire-Bond CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola wire-
bond CQFP package.
1.7.1.1 Package Parameters
The package parameters for the Motorola wire-bond CQFP are as provided in the following list. The
package type is 32 mm x 32 mm, 240-pin ceramic quad at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm (20 mil)
Maximum module height
4.15 mm
TS
149
Low
I/O
TT[0–4]
191, 190, 185, 184, 180
High
I/O
VDD
4, 14, 24, 34, 44, 59, 122, 137, 147, 157, 167, 177, 207
High
Input
WT
236
Low
Output
XATS
150
Low
I/O
Notes:
1. These are test signals for factory use only and must be pulled up to Vdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core. Future
members of the 603 family may use different OVdd and Vdd input levels; for example, OVdd = 3.3 V or
5.0 V, with Vdd = 2.5 V.
Table 10. PowerPC 603 Microprocessor Pinout Listing (Continued)
Signal Name
Pin Number
Active
I/O
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.
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