參數(shù)資料
型號: MPC740ARX233LX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù): 22/44頁
文件大?。?/td> 558K
代理商: MPC740ARX233LX
MPC750A RISC Microprocessor Hardware Specications
29
Package Description
1.7 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC740, 255
CBGA packages.
1.7.1 Parameters for the MPC740
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead
ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
1.7.2 Mechanical Dimensions of the MPC740
Figure 16 provides the mechanical dimensions and bottom surface nomenclature of the MPC740, 255
CBGA package.
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For More Information On This Product,
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