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| 型號： | MPC740ARX233LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 25/44頁 |
| 文件大?。?/td> | 558K |
| 代理商： | MPC740ARX233LX |
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MPC750A RISC Microprocessor Hardware Specications
31
System Design Information
1.7.4 Mechanical Dimensions of the MPC750
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the MPC750, 360
CBGA package.
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC750
1.8 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC750.
DIM
MIN
MAX
MILLIMETERS
A
2.72
3.20
A1
0.80
1.00
A2
1.10
1.30
A3
---
0.60
A4
0.82
0.90
b
D
25.00 BSC
D1
22.86 BSC
D2
---
12.50
D3
2.75
---
D4
6.00
9.00
e
1.27 BSC
E
25.00 BSC
E1
22.86 BSC
E2
---
14.30
3.00
---
E4
8.00
11.00
NOTES:
1.
DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
DIMENSION b IS THE MAXIMUM SOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM A.
4.
D2AND E2 DEFINE THEAREA OCCUPIED BY THE
DIE AND UNDERFILL. ACTUAL SIZE OF THIS
AREA MAY BE SMALLER THAN SHOWN. D3 AND
E3 ARE THE MINIMUM CLEARANCE FROM THE
PACKAGE EDGE TO THE CHIP CAPACITORS.
5.
CAPACITORS MAY NOT BE PRESENT ON ALL
DEVICES.
6.
CAUTION MUST BE TAKEN NOT TO SHORT
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
0.3 A
0.15 A
0.25 A
C
L
A
D
E
C
E4
E2
B
1
PIN A1
INDEX
2X
D4
D2
D3
2X
E3
TOP VIEW
18X
2X
0.2
2X
0.35 A
0.15 A
B C
0.82
0.93
BOTTOM VIEW
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
123456789 10111213141516171819
C
L
SIDE VIEW
A
D1
E1
360X
b
e
18X
e
A1
A2
A3
A4
360X
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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