參數(shù)資料
型號： MPC755BRX450LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù)： 41/52頁
文件大?。?/td> 1278K
代理商： MPC755BRX450LE
46
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Document Revision History
1.9
Document Revision History
Table 19 provides a revision history for this hardware specification.
Table 19. Document Revision History
Document Revision
Substantive Change(s)
Rev 0
Product announced. Documentation made publicly available.
Rev 1
Corrected errors in Section 1.2, “Features.”
Removed references to MPC745 CBGA package in Sections 1.3 and 1.4.
Added airflow values for
θ
JA to Table 5.
Corrected VIH maximum for 1.8 V mode in Table 6.
Power consumption values added to Table 7.
Corrected tMXRH in Table 9, deleted Note 2 application note reference.
Added Max fL2CLK and Min tL2CLK values to Table 11.
Updated timing values in Table 12.
Corrected Note 2 of Table 13.
Changed Table 14 to reflect I/F voltages supported.
Removed 133 MHz and 150 MHz columns from Table 16.
Added document reference to Section 1.7.
Added DBB to list of signals requiring pull-ups in Section 1.8.7.
Removed log entries from Table 20 for revisions prior to public release.
Rev 2
1.8 V/2.0 V mode no longer supported; added 2.5 V support.
Removed 1.8 V/2.0 V mode data from Tables 2, 3, and 6.
Added 2.5 V mode data to Tables 2, 3, and 6.
Extended recommended operating voltage (down to 1.8 V) for VDD, AVDD,
and L2AVDD for 300 MHz and 350 MHz parts in Table 3.
Updated Table 7 and test conditions for power consumption specifications.
Corrected Note 6 of Table 9 to include TLBISYNC as a mode-select signal.
Updated AC timing specifications in Table 10.
Updated AC timing specifications in Table 12.
Corrected AC timing specifications in Table 13.
Added L1_TSTCLK, L2_TSTCLK, and LSSD_MODE pull-up requirements to
Corrected Figure 22.
相關PDF資料
PDF描述
MPC755CPX400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC745BVT350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
MPC755CRX400 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關代理商/技術參數(shù)
參數(shù)描述
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
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