參數(shù)資料
型號(hào)： MPC755BRX450LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 43/52頁(yè)
文件大?。?/td> 1278K
代理商： MPC755BRX450LE
48
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Ordering Information
1.10 Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Fully Addressed by This Document,” lists the part numbers which do not fully conform to the specifications
of this document. These special part numbers require an additional document called a part number
specification.
1.10.1 Part Numbers Fully Addressed by This Document
Table 20 provides the Motorola part numbering nomenclature for the MPC755 and MPC745. Note that the
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Motorola sales office. In addition to the processor frequency, the part numbering scheme
also includes an application modifier which may specify special application conditions. Each part number
also contains a revision code which refers to the die mask revision number.
1.10.2 Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications which supplement and supersede this document; see
Table 20. Part Numbering Nomenclature
MPC
xxx
B
xx
nnn
x
Product
Code
Part
Identifier
Process
Descriptor
Package 1
Processor
Frequency 2
Application
Modifier
Revision Level
MPC
755
745
B = HiP4DP PX = PBGA
RX = CBGA
300
350
400
L: 2.0 V ± 100 mV
0
° to 105°C
E: 2.8; PVR = 0008 3203
755
RX = CBGA
450
Notes:
1. See Section 1.7, “Package Description” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in
this specification support all core frequencies. Additionally, parts addressed by Part Number Specifications
may support other maximum core frequencies.
Table 21. Part Numbers with Separate Documentation
Part Number Series
Operating Conditions
Document Order Number of
Applicable Specification
XPC755BRX
nnnLD
XPC755BPX
nnnLD
XPC745BPX
nnnLD
2.0 V ± 100 mV, 0
° to 105°C
XPC755BLDPNS/D
Note: For other differences, see applicable specifications.
相關(guān)PDF資料
PDF描述
MPC755CPX400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC745BVT350 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
MPC755CRX400 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
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