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參數(shù)資料
| 型號： | MPC8241LZP200X |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
| 封裝： | 25 X 25 MM, PLASTIC, BGA-357 |
| 文件頁數(shù)： | 42/56頁 |
| 文件大?。?/td> | 739K |
| 代理商： | MPC8241LZP200X |
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MOTOROLA
MPC8241 Integrated Processor Hardware Specifications
47
System Design Information
1.7.8.1
Internal Package Conduction Resistance
For the PBGA, die-up, packaging technology, shown in Figure 27, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 29 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 29. PBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this die-up, wire-bond PBGA package, heat generated on the active side of the chip is conducted mainly
through the mold cap, the heat sink attach material (or thermal interface material), and finally through the
heat sink where it is removed by forced-air convection.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended between the top of the mold cap and the bottom of the heat
sink to minimize the thermal contact resistance. For those applications where the heat sink is attached by
spring clip mechanism, Figure 30 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of
contact pressure. As shown, the performance of these thermal interface materials improves with increasing
contact pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 27). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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| MPC8241LZQ200D | 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241LZQ200D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357 |
| MPC8241LZQ266D | 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8241TVR166D | 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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