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參數(shù)資料
| 型號： | MPC8241TZQ166D |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 48/58頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 32BIT 166MHZ 357-PBGA |
| 標準包裝： | 44 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 166MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 357-BBGA |
| 供應(yīng)商設(shè)備封裝： | 357-PBGA（25x25） |
| 包裝： | 托盤 |
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MPC8241 Integrated Processor Hardware Specifications, Rev. 10
52
Freescale Semiconductor
Ordering Information
where:
TT = thermocouple temperature atop the package (°C)
ψ
JT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance minimizes the change in thermal
performance that is caused by removing part of the thermal interface to the heat sink. Considering the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
In many cases, it is appropriate to simulate the system environment using a computational fluid dynamics
thermal simulation tool. In such a tool, the simplest thermal model of a package that has demonstrated
reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a
junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink is used or
a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal
resistance describes the thermal performance when most of the heat is conducted to the printed-circuit
board.
7.8
References
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
8
Ordering Information
Ordering information for the parts that this document fully covers is provided in Section 8.1, “Part
Document,” lists the part numbers which do not fully conform to the specifications of this document.
These special part numbers require an additional document called a hardware specifications addendum.
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