參數(shù)資料
型號(hào)： MPC8245LZU333B
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁數(shù)： 44/64頁
文件大?。?/td> 940K
代理商： MPC8245LZU333B
MOTOROLA
MPC8245 Integrated Processor Hardware Specifications
49
System Design Information
1.7.8
Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, heat sinks
may be required to maintain junction temperature within specifications. Proper thermal control design is
primarily dependent upon the system-level design: the heat sink, airflow, and thermal interface material. To
reduce the die-junction temperature, heat sinks may be attached to the package by several methods:
adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly;
Figure 29. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 30 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package and there exists a high board-level thermal loading
from adjacent components.
A heat sink is not attached to the TBGA package and there exists a low board-level thermal loading
from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package and there exists high
board-level thermal loading from adjacent components.
A heat sink (for example, ChipCoolers) is attached to the TBGA package and there exists low
board-level thermal loading from adjacent components.
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Adhesive or
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8245LZU333D 功能描述:微處理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245LZU350D 功能描述:微處理器 - MPU 350MHz 665MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245RZU400D 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series
MPC8245TVV266D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8245TVV300D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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