參數(shù)資料
型號： MPC8245TZU333D
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 333 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁數(shù)： 50/60頁
文件大小： 674K
代理商： MPC8245TZU333D
54
MPC8245 Integrated Processor Hardware Specications
MOTOROLA
System Design Information
where:
TT = thermocouple temperature atop the package (°C)
Ψ
JT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specication using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that
the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed at
against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire.
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difculties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the interface.
From this case temperature, the junction temperature is determined from the junction-to-case thermal
resistance.
In many cases, it is appropriate to simulate the system environment using a computational uid dynamics
thermal simulation tool. In such a tool, the simplest thermal model of a package which has demonstrated
reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a
junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink will be used
or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board
thermal resistance describes the thermal performance when most of the heat is conducted to the
printed-circuit board.
1.7.10 References
Semiconductor Equipment and Materials International
805 East Middleeld Rd.
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specications are available on the WEB at http://www.jedec.org.
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相關(guān)代理商/技術(shù)參數(shù)
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