參數(shù)資料
型號(hào)： MPC8247ZQTMFA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 9/61頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 400MHz
電壓： 1.5V
安裝類型： 表面貼裝
封裝/外殼： 516-BBGA
供應(yīng)商設(shè)備封裝： 516-FPBGA（27x27）
包裝： 托盤
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
Freescale Semiconductor
17
Power Dissipation
4.7
References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications800-854-7179 or
(Available from Global Engineering Documents)303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
5
Power Dissipation
This table provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, see Section 7, “Clock Configuration Modes.”
Table 8. Estimated Power Dissipation for Various Configurations1
1 Test temperature = 105° C
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
CPU
(MHz)
PINT(W)
2,3
2 P
INT = IDD x VDD Watts
3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Vddl 1.5 Volts
Nominal
Maximum
66.67
3
200
4
266
1
1.2
100
2
200
3
300
1.1
1.3
100
2
200
4
400
1.3
1.5
133
2
267
3
400
1.5
1.8
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