參數(shù)資料
型號: MPC8271CZQMIBA
廠商: Freescale Semiconductor
文件頁數(shù): 52/61頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝: 40
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 266MHz
電壓: 1.5V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
56
Freescale Semiconductor
Package Description
9
Package Description
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 13. Side View of the PBGA Package Remove
9.1
Package Parameters
This table provides package parameters.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (see Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free
Packaging Information” (MPC8250PBFREEPKG) available on
www.freescale.com.
Table 22. Package Parameters
Code
Type
Outline
(mm)
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
VR, ZQ
PBGA
27 x 27
516
1
2.25
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
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