參數(shù)資料
型號(hào)： MPC8271CZQMIBA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 6/61頁(yè)
文件大?。?/td> 0K
描述： IC MPU POWERQUICC II 516-PBGA
標(biāo)準(zhǔn)包裝： 40
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 1.5V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 516-BBGA
供應(yīng)商設(shè)備封裝： 516-FPBGA（27x27）
包裝： 托盤(pán)
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
14
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
This table describes thermal characteristics. See Table 2 for information on a given SoC’s package.
Discussions of each characteristic are provided in Section 4.1, “Estimation with Junction-to-Ambient
Thermal Resistance,” through Section 4.7, “References.” For the these discussions, PD =(VDD × IDD) +
PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4 MPC8280, MPC8275VR, MPC8275ZQ only.
Table 7. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board1
1 Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
—
Junction-to-case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
—
Junction-to-package top4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
—
相關(guān)PDF資料
PDF描述
IDT70V639S12PRF8 IC SRAM 2.25MBIT 12NS 128TQFP
IDT70V3589S133BFI8 IC SRAM 2MBIT 133MHZ 208FBGA
MPC8265AVVPJDC IC MPU POWERQUICC II 480-TBGA
HFW24R-2STE1LF CONN FPC/FFC 24POS 1MM R/A SMD
RMC60DTEF CONN EDGECARD 120PS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8271CZQP 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
MPC8271CZQPIEA 功能描述:微處理器 - MPU PQ27E A W/O TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8271CZQT 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8271CZQTIEA 功能描述:微處理器 - MPU PQ27E A W/O TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8271VR 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*