參數(shù)資料
型號: MPC8343CVRADDX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
文件頁數(shù): 16/92頁
文件大小: 987K
代理商: MPC8343CVRADDX
MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
23
Ethernet: Three-Speed Ethernet, MII Management
7.2
MII, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for MII, RGMII, and RTBI are presented in this section.
7.2.1
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
7.2.1.1
MII Transmit AC Timing Specifications
Table 18 provides the MII transmit AC timing specifications.
Table 17. RGMII/RTBI (When Operating at 2.5 V), DC Electrical Characteristics
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LVDD
2.37
2.63
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.00
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
GND – 0.3
0.40
V
Input high voltage
VIH
—LVDD = Min
1.7
LVDD + 0.3
V
Input low voltage
VIL
—LVDD =Min
–0.3
0.70
V
Input high current
IIH
VIN
1 = LV
DD
—10
A
Input low current
IIL
VIN
1 = GND
–15
A
Note:
1. Note that the symbol VIN, in this case, represents the LVIN symbol referenced in Table 55and Table 56.
Table 18. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD / OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
400
ns
TX_CLK clock period 100 Mbps
tMTX
—40—
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
1
5
15
ns
TX_CLK data clock rise VIL(min) to VIH(max)
tMTXR
1.0
4.0
ns
TX_CLK data clock fall VIH(max) to VIL(min)
tMTXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs
(D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
相關PDF資料
PDF描述
MPC8343ZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343EZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343ECVRADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8343CVRAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343CZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
相關代理商/技術參數(shù)
參數(shù)描述
MPC8343CVRAGD 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設備封裝:783-FCPBGA(29x29) 包裝:托盤
MPC8343CVRAGDB 功能描述:微處理器 - MPU 8347 PBGA NO-PB W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343CZQADD 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設備封裝:783-FCPBGA(29x29) 包裝:托盤
MPC8343CZQADDB 功能描述:微處理器 - MPU 8347 PBGA W/O ENC W/ PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343CZQAGD 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應商設備封裝:783-FCPBGA(29x29) 包裝:托盤