參數(shù)資料
型號(hào): MPC8343CVRADDX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
文件頁(yè)數(shù): 79/92頁(yè)
文件大小: 987K
代理商: MPC8343CVRADDX
MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 6
80
Freescale Semiconductor
Thermal
19.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RθJA × PD)
where:
TC = case temperature of the package (°C)
RθJC = junction to case thermal resistance (°C/W)
PD = power dissipation (W)
相關(guān)PDF資料
PDF描述
MPC8343ZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343EZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343ECVRADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8343CVRAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343CZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
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