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參數(shù)資料
| 型號： | MPC8349ECVVALD |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 667 MHz, MICROPROCESSOR, PBGA672 |
| 封裝： | 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672 |
| 文件頁數(shù)： | 73/88頁 |
| 文件大小： | 1014K |
| 代理商： | MPC8349ECVVALD |
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MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
75
Thermal
TT = thermocouple temperature on top of package (°C)
Ψ
JT = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
20.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
Some application environments require a heat sink to provide the necessary thermal management of the
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 60 shows heat sink thermal resistance for TBGA of the MPC8349E.
Table 60. Heat Sink and Thermal Resistance of MPC8349E (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
10
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
6.5
AAVID 30
× 30 × 9.4 mm pin fin
2 m/s
5.6
AAVID 31
× 35 × 23 mm pin fin
Natural convection
8.4
AAVID 31
× 35 × 23 mm pin fin
1 m/s
4.7
AAVID 31
× 35 × 23 mm pin fin
2 m/s
4
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| MPC8349ECVVALDB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349ECVVALFB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349ECZUAGDB | 功能描述:微處理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8349ECZUAGFB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349ECZUAJDB | 功能描述:微處理器 - MPU 8349 TBGA W/ ENCRYP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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