參數(shù)資料
型號(hào): MPC8533VTAQGA
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 18/112頁(yè)
文件大?。?/td> 0K
描述: MPU POWERQUICC 783-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤(pán)
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
13
Power Characteristics
3
Power Characteristics
The estimated typical core power dissipation for the core complex bus (CCB) versus the core frequency
for this family of PowerQUICC III devices is shown in Table 4.
4
Input Clocks
This section contains the following subsections:
Table 4. MPC8533E Core Power Dissipation
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD
(V)
Junction
Temperature (
C)
Power
(W)
Notes
Typical
667
333
1.0
65
2.6
1, 2
Thermal
90
3.75
1, 3
Maximum
5.85
1, 4
Typical
800
400
1.0
65
2.9
1, 2
Thermal
90
4.0
1, 3
Maximum
6.0
1, 4
Typical
1000
400
1.0
65
3.6
1, 2
Thermal
90
4.4
1, 3
Maximum
6.2
1, 4
Typical
1067
533
1.0
65
3.9
1, 2
Thermal
90
5.0
1, 3
Maximum
6.5
1, 4
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD) and 65C junction temperature
(see Table 2) while running the Dhrystone 2.1 benchmark.
3. Thermal power is the average power measured at nominal core voltage (VDD) and maximum operating junction temperature
(see Table 2) while running the Dhrystone 2.1 benchmark.
4. Maximum power is the maximum power measured at nominal core voltage (VDD) and maximum operating junction
temperature (see Table 2) while running a smoke test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep the execution unit maximally busy.
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